PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
: 20 Jul 2012 Location: Hollister, CA Status: Offline Points: 83 Post Options Post Reply Quote rdl86626 Report Post Thanks(1) Quote Reply Posted: 08 Mar 2013 at 8:35am Hi, We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS Assembly's only IPCF-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
: 20 Jul 2012 Location: Hollister, CA Status: Offline Points: 83 Post Options Post Reply Quote rdl86626 Report Post Thanks(1) Quote Reply Posted: 08 Mar 2013 at 8:35am Hi, We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS Assembly's only IPCF-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html
: 20 Jul 2012 Location: Hollister, CA Status: Offline Points: 83 Post Options Post Reply Quote rdl86626 Report Post Thanks(1) Quote Reply Posted: 08 Mar 2013 at 8:35am Hi, We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS Assembly's only IPCF-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html
specified IPC standards on here? Any and all thoughts are welcome! I will start this, Currently we only specify the following:- IPC-A-600 - Acceptability of Printed Boards IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 - Specification for Base Materials for High Speed / High
| https://www.eptac.com/faqs/ask-helena-leo/ask/copper-elongation-and-tensile-strength-requirements
. The place to find that information in IPC documents is in IPC-4101, Specification for Base Materials and Rigid and Multilayer Printed Boards
| https://www.eptac.com/ask/copper-elongation-and-tensile-strength-requirements/
. The place to find that information in IPC documents is in IPC-4101, Specification for Base Materials and Rigid and Multilayer Printed Boards
| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
. The intent is based upon IPC-4101 and whether or not leaded solder or lead-free solder is being used. You state “…Our present process: 2 heat excursions, thru reflow, 2 thru wave, one thru rework
| https://www.eptac.com/ask/reliability-of-reworked-lead-free-assemblies/
. The intent is based upon IPC-4101 and whether or not leaded solder or lead-free solder is being used. You state “…Our present process: 2 heat excursions, thru reflow, 2 thru wave, one thru rework
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG
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