| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing? Answer
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
. Standard Spec Boards (PCB's) are inspected to IPC Class 2 Standards and Custom Spec Boards are inspected to either IPC Class 2 or Class 3 depending on the option to be chosen
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
. Standard Spec Boards (PCB's) are inspected to IPC Class 2 Standards and Custom Spec Boards are inspected to either IPC Class 2 or Class 3 depending on the option to be chosen
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
. Standard Spec Boards (PCB's) are inspected to IPC Class 2 Standards and Custom Spec Boards are inspected to either IPC Class 2 or Class 3 depending on the option to be chosen
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html
. Standard Spec Boards (PCB's) are inspected to IPC Class 2 Standards and Custom Spec Boards are inspected to either IPC Class 2 or Class 3 depending on the option to be chosen
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
IPC is the trade association for the printed wiring board and electronics assembly industries.
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Bannockburn, IL USA
Phone: 847-615-7100
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