Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Joints,” Proceedings of SMTAI 2006, 406-415, Chicago, IL, September 2006. [4] IPC-A-610D, “Acceptability of Electronics Assemblies,” Section 8.2.12.4, 8-83, IPC, February 2005. [5] IPC-7095B, “Design and Assembly Process Implementation for BGAs,” Section
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
Joints,” Proceedings of SMTAI 2006, 406-415, Chicago, IL, September 2006. [4] IPC-A-610D, “Acceptability of Electronics Assemblies,” Section 8.2.12.4, 8-83, IPC, February 2005. [5] IPC-7095B, “Design and Assembly Process Implementation for BGAs,” Section
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Another constraint is to ensure that all IPC 610D solder joint inspection criteria are met (some papers have been written that suggest that hole fill requirements could be reduced while still maintaining sufficient reliability [11
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