| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
PCB land pattern soldered BGA? I have seen a describtion in IPC-7093 6.1.3.6 solder mask design. NSMD is better than SMD on QFN solder joint strenth
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/smd-solder-mask-defined-and-nsmd-pads_topic1768_post7236.html
? I have seen a describtion in IPC-7093 6.1.3.6 solder mask design. NSMD is better than SMD on QFN solder joint strenth. Should I assume that NSMD is first option for other chip, sop and connectors
| https://www.eptac.com/faqs/ask-helena-leo/page/9
: I have a bowed part on a bottom terminated part, and I’m trying to find the specification on such a part. Do you know the bow specification of IPC 7093, section
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154_post11220.html
. The new updates to upcoming revision to IPC-7093 will be teaching PCB designers to create a Solder Mask Defined Thermal Pad to create solder dams between the checker board pattern and around the vias
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2154&OB=ASC.html
. The new updates to upcoming revision to IPC-7093 will be teaching PCB designers to create a Solder Mask Defined Thermal Pad to create solder dams between the checker board pattern and around the vias
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154_post10556.html
. The new updates to upcoming revision to IPC-7093 will be teaching PCB designers to create a Solder Mask Defined Thermal Pad to create solder dams between the checker board pattern and around the vias
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray. This course identifies many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes
Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm
: QFN Package Background IPC-7093 Standard Pad Design Impacts/Influences QFN Thermal Pad Voiding Manufacturing Implementation - Stenciling - Reflow - Cleaning Solder Joint Reliability
