Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/
Guide to a Successful Lead-Free Soldering - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/guide-to-a-successful-lead-free-soldering/
Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT Recertification IPC 7711/7721 CIT IPC 7711/7721 CIT Recertification IPC-A-600 CIT IPC-A-600 CIT Recertification IPC/WHMA A-620 CIT IPC/WHMA A-620 CIT Recertification IPC/WHMA A-620 CIT with HANDS-ON IPC/WHMA-A
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_600-CIT.pdf
■ Subcontractor Qualification ■ Equipment Evaluation ■ Lead-Free, ESD, Process and Quality Audits COURSE DESCRIPTION This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual criteria examples for all three classes of
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/printed-circuit-board-repair/
PCB Repair Training by Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-design-basics_forum8.xml
. Then after the drill oversize and the layer to layer tolerance you still need to have 1 mil annular ring. IPC Class 3Hole = 8 mil (0.20 mm)Pad = 20 mil (0.50 mm)IPC Class 2Hole = 8 mil (0.20 mm)Pad = 18 mil (0.45 mm)The via hole tolerance would be
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
. Rather than put a trademark symbol in every occurrence of a trademarked name, we state that we are using the names in an editorial fashion only and to the benefit of the trademark owner with no
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
models with a paper roll discard bin, remove the used paper from the bin. For details, refer to Paper Pad in the Dispense System User Guide. 5/18/18 Dispense System Service Guide 4.5 GPD Global© Routine Maintenance: Schedules Quarterly Maintenance Table 5
