PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&OB=asc_page27.html
:18am Preferences question - Terminal SM oversize By jnshah , 20 Apr 2018 at 12:11pm 5 785 By jnshah 26 Apr 2018 at 6:59am Library Expert Pro Default CAD Tool At Startup By btm3678 , 30 Apr 2018 at 8
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34_page11.html
:41pm 4 681 By Todd Manning 15 Jun 2018 at 3:59pm Which Version Of IPC-7351? By laura , 05 Jun 2018 at 8:29am 1 1640 By Tom H 05 Jun 2018 at 9
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&SO=UR&OB=desc_page10.html
:51am 3 921 By Tom H 21 Mar 2018 at 7:35am QFN Unique Pads By craig4tone , 19 Apr 2018 at 6:37am 1 347 By Tom H 19 Apr 2018 at 7:18am Preferences question - Terminal SM oversize By jnshah , 20 Apr 2018 at 12
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1868&OB=ASC.html
- Here is a non-collapsing BGA ball with a solder mask defined pad. IPC has guidance to avoid this, but it's impossible for pin pitches below
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic888&OB=ASC.html
Posted: 14 Mar 2013 at 4:29am Not sure what the intention is for footprints of BGAs but I was under the impression there is (or was) no environment for BGAs and this is indicated in in the " FOOTPRINT NAMING CONVENTION " for Standard SM Components" PDF
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:35am QFN Unique Pads By craig4tone , 19 Apr 2018 at 6:37am 1 452 By Tom H 19 Apr 2018 at 7:18am Preferences question - Terminal SM oversize By jnshah , 20 Apr 2018 at 12
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news?div=6472146fb99d4e978b78f421109e12e4&qs=t&page=1
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