| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components
. Solder joints typically fail by fatigue from thermal cycling and there are IPC specifications which evaluate thermal cycling, hence it all depends where the product is to be used and the environment it is to be used in
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/
The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract 29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and
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