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AVX TurboCap Footprint - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/avx-turbocap-footprint_topic42_post111.html

.   Also, the "J Style Leads" are really "Outward L Bend" -     The new upcoming 2012 IPC Footprint Calculator is component lead based to handle every component family

PCB Libraries, Inc.

AVX TurboCap Footprint - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic42&OB=DESC.html

 RLS2004 Report Post    Thanks(0)    Quote    Reply Posted: 27 Apr 2012 at 12:56pm Hi Tom, Thanks for the reply. Did you note that the "J style leads" on this part bend UNDER the component

PCB Libraries, Inc.

19 EWS Questions of July .PPT [Read-Only]

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_07_15_09.pdf

? Is it the same requirements as a lead to a terminal? 9 J-STD-001 Requirements  5.4.1.3 Stress Relief – Component leads shall have stress relief

Trimming heels under the component body - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post3020.html

(possibly from vibration)?  Might that cause stress on the parts and possibly crack them?  I expect the leads will bend better than a component body would against the solder, but I could be wrong

PCB Libraries, Inc.

Trimming heels under the component body - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic12&OB=ASC.html

(possibly from vibration)?  Might that cause stress on the parts and possibly crack them?  I expect the leads will bend better than a component body would against the solder, but I could be wrong

PCB Libraries, Inc.

Trimming heels under the component body - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post23.html

(possibly from vibration)?  Might that cause stress on the parts and possibly crack them?  I expect the leads will bend better than a component body would against the solder, but I could be wrong

PCB Libraries, Inc.

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

. Ignore all references to Stations 4 & 5 (they are not present on the CF-15). 2. Roller or dimpling dies are not applicable. 3. No crimping on the component leads is performed

GPD Global

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

. Ignore all references to Stations 4 & 5 (they are not present on the CF-15). 2. Roller or dimpling dies are not applicable. 3. No crimping on the component leads is performed

GPD Global

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IPC Training & Certification - Blackfox

Component Placement 101 Training Course
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