PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMPHENOL&PN=34-1030-12G
! customer login required - 2 credits Status: Active Mounting Type: Through-hole Logical Description: Connector, HD-BNC Right Angle PCB Jack, 12G Optimized, Bulkhead, 75 Ohm Physical Description
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMPHENOL&PN=132134
! customer login required - 2 credits Status: Active Updated: 10/27/2022 Mounting Type: Hybrid Logical Description: Connector, Co-Axial, SMA Jack Physical Description
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/china-packaging-annual-forum-2014
Annual Forum 2014 China Packaging Annual Forum 2014 Chongqing, China 2014-06-04 - 2014-06-06 Hear Dr. Jiangang (Jack) Zhao of Nordson MARCH speak about plasma for wafer level packaging (WLP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/deposition?con=t&page=11
. HuaYong He of Nordson MARCH present on Plasma for Improved Adhesion Prior to Molding and Underfill China Packaging Annual Forum 2014 Nordson MARCH Hear Dr. Jiangang (Jack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smta-pan-pacific-symposium-2018
. Jack Zhao from Nordson MARCH will be presenting his paper entitled “Uniformity Considerations in Capacitively Coupled Plasma.” When considering the use of plasma in large sample treatments, uniform plasma treatment is always desirable
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/automotive-and-transportation?con=t&page=21
. China Packaging Annual Forum 2014 Nordson MARCH Hear Dr. Jiangang (Jack) Zhao of Nordson MARCH speak about plasma for wafer level packaging (WLP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/automotive-and-transportation?con=t&page=9
Wafer-Level Packaging at ICEPT Nordson MARCH Dr. Jack Zhao shares data for WLP improvements with plasma treatment Nordson MARCH introduces the new FlexTRAK-CDS Plasma System for high-throughput plasma treatment of strip-type electronic components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems?con=t&page=12
MARCH China Packaging Annual Forum 2014 Nordson MARCH Hear Dr. Jiangang (Jack) Zhao of Nordson MARCH speak about plasma for wafer level packaging (WLP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/ash-and-descum?con=t&page=9
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT Nordson MARCH Dr. Jack Zhao shares data for WLP improvements with plasma treatment Nordson MARCH introduces the new FlexTRAK-CDS Plasma System for high-throughput plasma treatment of strip-type electronic components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/etchback-and-desmear?con=t&page=10
. Jack Zhao shares data for WLP improvements with plasma treatment Nordson MARCH introduces the new FlexTRAK-CDS Plasma System for high-throughput plasma treatment of strip-type electronic components
