ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
-794-8563 (Fax) B e i j i n g GE Plastics Citic Building, 3rd Floor No. 19 Jian Guo Men Wai Av e n u e Beijing 100004 China (86) 10-6500-6538 (86) 10-6500-6476 (Fax) G u a n g z h o u GE Plastics Guangzhou Room 1212, Yi An Plaza No. 38, Jian She 6 Road
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Jean-Paul Clech, EPSI Inc.; Gregory Henshall and Jian Miremadi, HP Company "Closed-Form, Strain-Energy Based Acceleration Factors for Thermal Cycling of Lead-Free Assemblies" 2008
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, Takashi Nozu, and Tetsuro Nishimura “Optimizing Solder Paste for Void Minimization with Vacuum Reflow,” Proceedings of SMTAI 2012, 903-910, Orlando, FL, October 2012. [19] Gregory Henshall, Jian Miremadi, Richard Parker, Richard Coyle, Joe Smetana, Jennifer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
, Takashi Nozu, and Tetsuro Nishimura “Optimizing Solder Paste for Void Minimization with Vacuum Reflow,” Proceedings of SMTAI 2012, 903-910, Orlando, FL, October 2012. [19] Gregory Henshall, Jian Miremadi, Richard Parker, Richard Coyle, Joe Smetana, Jennifer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
, Takashi Nozu, and Tetsuro Nishimura “Optimizing Solder Paste for Void Minimization with Vacuum Reflow,” Proceedings of SMTAI 2012, 903-910, Orlando, FL, October 2012. [19] Gregory Henshall, Jian Miremadi, Richard Parker, Richard Coyle, Joe Smetana, Jennifer
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