Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
]] found that the presence of a voids was not necessarily sufficient to lower solder joint reliability. Rather, the location of void relative to the solder joint failure crack path has a much larger impact than the existence of the void alone. Figure 3
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]] found that the presence of a voids was not necessarily sufficient to lower solder joint reliability. Rather, the location of void relative to the solder joint failure crack path has a much larger impact than the existence of the void alone. Figure 3
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/solutions/construction-and-architecture
/ prefabricated home construction projects. Joint and Crack Filling Applications Include: Highways Runways Tunnels Sidewalks In-Ground Pools Concrete Walls Parking Decks Flooring Bonding and Sealing Applications Include
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/
. The reason we do not twist wires to create splices is that it may affect the reliability of the solder joint. Over stress may crack and separate this type of splice
| https://pcbasupplies.com/alloy-solder-paste-enig/
. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike
| https://www.eptac.com/soldertip/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/
. The reason we do not twist wires to create splices is that it may affect the reliability of the solder joint. Over stress may crack and separate this type of splice
