| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Does this mean we should remove the ICs from their tape and reel packaging, tin the leads for proper gold removal, then re-reel the parts for proper packaging for pick and place equipment
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TAPE DECK 0730C-0388 TAPE DECK SHOULDER SCREW 0731C-0013 INBOARD COMP DIVERTER 0731C-0014 COMP DIVERTER RETAINER 0731C-0015 LOWER COMP DIVERTER 8mm High Performance DL-60 (Gold) 49889207/49889208 0730A-0038 HEATSINK WITH GAP PAD 0730A-0012 RESERVOIR
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(IT) ¥ 0.00 0.0 CNY SM 12MM Feeder (IT) ¥ 0.00 0.0 CNY Optical fiber sensor ¥ 0.00 0.0 CNY Push pull tester ¥ 0.00 0.0 CNY POgo pin holder ¥ 0.00 0.0 CNY Sensor ¥ 0.00 0.0 CNY Timing Belt (025-XL-396-A) ¥ 0.00 0.0 CNY Kapton tape ¥ 0.00
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) 7-13" 50934704 8mm High Performance (Gold Plus) Spliceable Tape Feeder 50934705 8mm High Performance (Gold Plus) Spliceable Tape Feeder 50934706 8mm High Performance (Gold Plus
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) Spliceable Tape Feeder 50934705 8mm High Performance (Gold Plus) Spliceable Tape Feeder 50934706 8mm High Performance (Gold Plus) Spliceable Tape Feeder 50934707 8mm High Performance (Gold Plus
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parts Public Pricelist Public Pricelist Regulator ¥ 0.00 0.0 CNY XY Amp Board Repair ¥ 0.00 0.0 CNY Vacuum Pad 8 ¥ 0.00 0.0 CNY Vacuum Pad 4 ¥ 0.00 0.0 CNY SPRING ¥ 0.00 0.0 CNY Multi-Step Tray Magazine
. Can you explain what the “standard industry practice” is? Read Answer J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed Question
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=11
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud