ORION Industries | http://orionindustries.com/pdfs/fr700.pdf
Lexan FR 700-701 Film LEXAN® FR 700–701 FILM DESCRIPTION LEXAN® FR 700–701 is an opaque black , flame retardant polycarbonate film
ORION Industries | http://orionindustries.com/pdfs/lexanfr60.pdf
GE LEXAN FR-60, FR-63, FR-65, FR-66 Film LEXAN® FR–60, FR-63, FR-65, FR-66 FILM DESCRIPTION LEXAN ® FR–60 flame retardant film is a clear, thin-gauge polycarbonate film with polished surfaces on both sides. WIth UL94 V–0
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
) is used to apply areas that will becomes the traces, pads, and metal ground of a printed circuit board. A dry film is applied to a copper laminate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2021-06-29
BKG - EDI Corporate | Global Directory | Languages Division Only All of Nordson Home Products Applications Blown Film Cast Film Compounding Extrusion Coating and Laminating Fiber and Filaments Fluid Coating Foaming Hot Melt Masterbatch Non
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
™ Adhesive Transfer 200MP/ 2.3 mils 1) Clear HDPE Film, No Print 1) 3.0 mils Tape 9172MP Clear (0.06 mm) 2) Tan, 58# Polycoated Kraft, 50 grams/inch No Print 2
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
) is a medium that connects electronic components in a controlled manner. It has a laminated sandwich structure such that each layer contains circuit traces and other features etched onto sheets of copper
ORION Industries | http://orionindustries.com/pdfs/PORONURETHANE.pdf
. PORON urethanes are supplied in continuous rolls and can be easily fabricated: die-cut, slit, machined and laminated. An outstanding combination of properties are exhibited by PORON urethanes: PORON®
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
– Laminates consist of prepregs and foils that have been laminated and cured together with heat and glass. These can be made out of a variety of thicknesses and different types of epoxy and glass waves. Solder Mask
Imagineering, Inc. | https://www.pcbnet.com/blog/future-printed-circuit-boards-trends-to-watch-for/
. For example, differences in the coefficient of thermal expansion (CTE) can cause laminated materials to separate when the temperature changes
