ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. For applications where the BGA may be subjected to regular shocks (for example in a mobile phone) mechanical pull and shear testing ensures adhesion strength is acceptable and protects against future latent failures. More information
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. A lack of proper control will result in internal component damage during reflow due to moisture expansion. This will typically create insidious latent component defects that can escape inspection and test
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