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Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/reliability-of-reworked-lead-free-assemblies/
Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html
Posted: 26 Oct 2012 at 7:04am All pad shapes are Lead-Free. The pad shape has nothing to do with Lead-Free. The Rounded Rectangle Pad Shape is excellent for both Lead and Lead-Free solder
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2021.html
. Rounded pads are better for lead-free surface mount assembly using reflow, because lead-free solder doesn't flow as well as leaded solder and the aperture openings in the paste mask stencil are rounded corners
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic612&OB=ASC.html
. Rounded pads are better for lead-free surface mount assembly using reflow, because lead-free solder doesn't flow as well as leaded solder and the aperture openings in the paste mask stencil are rounded corners
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic612&OB=DESC.html
Posted: 26 Oct 2012 at 7:04am All pad shapes are Lead-Free. The pad shape has nothing to do with Lead-Free. The Rounded Rectangle Pad Shape is excellent for both Lead and Lead-Free solder
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=28
. Does PCB Pad Finish affect Voiding Levels in Lead-Free Assemblies Nordson DAGE USA - Mid West Region Nordson DAGE Please contact your nearest office for assistance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=8
. Quality and Reliability Investigation of Printed Circuit Board Micro-vias by X-ray Inspection Nordson DAGE Implications of Using Lead-Free Solders on X-ray Inspection of Flip Chips and BGA's Nordson
