| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements/
& A on Solder Resists and Conformal Coatings Defects: Lead Protrusion & Damaged Pins Key Tips & Techniques for Manually Reflowing of Solder Paste DOWNLOAD PDF PRESENTATION WATCH ON DEMAND Course Length: 20 Minutes | Cost: FREE | Presenter
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements
. DOWNLOAD PDF PRESENTATION WATCH ON DEMAND Course Length: 20 Minutes | Cost: FREE | Presenter: Leo Lambert Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. From the surfaces to be soldered of solder terminals plated with 2.54um [100uin
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. From the surfaces to be soldered of solder terminals plated with 2.54um [100uin
| https://www.eptac.com/soldertips/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/3-things-you-should-know-about-lead-free-soldering/
forces the electronics industry to look for safer alternatives, like lead-free solder. Lead-free solder can include various chemical elements such as tin, copper, zinc, manganese, silver, or gold, but the most commonly used is tin, silver, and copper, often abbreviated as SAC, derived
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint
. For example a surface mount component would take less time to solder than a plated through hole, since a plated through hole has more metal to heat up
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
: Select Your Alloy When choosing a solder alloy, there are a few questions that need to be answered. Does the alloy need to be lead free
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