| https://www.eptac.com/webinar/the-need-for-gold-removal-on-solderable-surfaces/
The Need for Gold Removal on Solderable Surfaces | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
). Bridging Formation of a solder alloy connection between two or more adjacent contacts. Bumped Circuit Boards Bare printed circuit boards that have had solder paste deposited and reflowed on the pads prior to component installation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
surface energy of the pad, or component lead, is greater than the surface energy of the solder. X Y Z Zero Halogen Solder flux manufactured with no intentionally added halogens. Contact our product specialists at info@nordsonefd.com to identify
| https://www.eptac.com/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
. For example a surface mount component would take less time to solder than a plated through hole, since a plated through hole has more metal to heat up
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) European Union Directive has significantly reduced the use of tin/lead surface finishes for component terminations. A reexamination of solder joint wetting of lead-free solders with the new component terminations is key to establishing thermal process profiles that ensure acceptable solder joint integrity
| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/faqs/ask-helena-leo/ask/maximum-limits-of-solder-bath-contamination
. For examples component coming in with Lead-free coating and need to be tin/lead coated, this is a preconditioning element, and the same applied if the tin plated components have to be changed to SAC
