| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) Failure in bond interface (in solder or at point of weld interface between lead or terminal and the board or substrate conductor to which the bond was made). (b-4
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
September, 2015 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Gold and electronics have
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
) Failure in bond interface (in solder or at point of weld interface between lead or terminal and the board or substrate conductor to which the bond was made). (b-4
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Question: Regarding gold removal requirement under Section
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
| https://www.eptac.com/webinars/the-need-for-gold-removal-on-solderable-surfaces/
& Damaged Pins Key Tips & Techniques for Manually Reflowing of Solder Paste DOWNLOAD PDF PRESENTATION WATCH ON DEMAND Course Length: 25 Minutes | Cost: FREE | Presenter: Leo Lambert Gold removal from component solderable surfaces has, for many years, long been required, but do you really understand the value of, or why we go through this process
| https://www.eptac.com/webinars/the-need-for-gold-removal-on-solderable-surfaces
? DOWNLOAD PDF PRESENTATION WATCH ON DEMAND Course Length: 25 Minutes | Cost: FREE | Presenter: Leo Lambert Gold removal from component solderable surfaces has, for many years, long been required, but do you really understand the value of, or why we go through this process
| https://www.eptac.com/ask/maximum-limits-of-solder-bath-contamination/
. For examples component coming in with Lead-free coating and need to be tin/lead coated, this is a preconditioning element, and the same applied if the tin plated components have to be changed to SAC
