| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/
J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
to be joined using sTIM are usually gold, with the silicon backside typically being PVD-deposited Ti/NiV/Au (80-200nm Au), and copper heatspreader/lids plated with Ni/Au (usually with 0.3-0.8um Au). Except for the inevitable presence of a film of
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc
| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
SMT Component handling feeder Axial component lead forming Radial component lead forming Solder dross recovery system Vision Measuring equipment Automation Industrial Custom Odd-form part insertion
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Electroless nickel electroless palladium immersion gold (ENEPIG) has a high solder strength and reduces corrosion, but it requires greater care in processing to achieve the best performance
