224 lead free solder to gold plated component results

SolderTips | EPTAC

| https://www.eptac.com/solder-tips/

: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”… Read Answer SolderTips

. –  From the surfaces to be soldered of solder terminals plated with 2.54 µm [100 µin] or more of gold thickness. –  A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component on or in the assembly, either Surface Mount or Plated Through Hole components 2 The Criteria J-STD-001 ES 4.5.1 Gold Removal

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

% of all surfaces to be soldered of surface mount components regardless of gold thickness. c.  From the surfaces to be soldered of solder terminals plated with 2.54 µm [100 µin

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH - EPTAC - Train. Work Smarter. Succ

| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth

? Review the depth of the board in the wave.  Try running the board at least ½ of the board thickness in the wave to use the hydrostatic pressure of the wave to push the solder up into the plated through holes

Soldertips

| https://www.eptac.com/faqs/soldertips?hsLang=en

: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Read More SolderTips

Soldertips

| https://www.eptac.com/faqs/soldertips

: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Read More SolderTips

FAQs: Clarification and Interpretation of a Variety of IPC Standards | EPTAC

| https://www.eptac.com/webinar/faqs-clarification-and-interpretation-of-a-variety-of-ipc-standards/

. Topics we will be reviewing are: Lead vs. Lead Free solders on gold plated boards. Product operating in high-temp environments exceeding liquid solder states

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs

. Solder iron temperature, solder iron heat capacity, preheating of the board, are all issues which need to be considered when trying to fill these types of plated through holes

SolderTips: Defining Shear Forces for Surface Mounted Components | EPTAC

| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/

. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help

Ask Questions | EPTAC

| https://www.eptac.com/ask/

-tinned with lead free – no clean solder, can it then be considered solid wire and then be soldered to a PCBA using water soluble flux? Read Answer IPC-A-600H PowerPoint Corrections for CIS Level Training Question: I’m looking for the corrections that are