| https://www.eptac.com/faqs/ask-helena-leo
: We have a through-hole integrated circuit (IC) component that has good wetting when it goes through the wave soldering machine, and the solder climbs pretty far up the lead
| https://www.eptac.com/ask/ipc-a-610-vs-j-std-001-and-what-does-what/
connector, assembly, etc., and it has all the illustrations and pictures which defines the differences between the acceptability of tin/lead soldering joints and lead-free solder joint
| https://www.eptac.com/webinars/page/6
: Understanding the Process and Assembly Requirements Length: 20 Minutes Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
-466 IPC-TR-465-3 IPC-TR-465-2 IPC-TR-465-1 J-STD-002 5-23b 7 IPC-A-610, Acceptability of Electronic Assemblies This documents contains visual representations of what good solder joints look like in addition to assembly criteria, hardware installation, terminal connections, through hole and surface mount
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. The 4000 Plus Bondtester measures the pull and shear adhesion strengths of components, and the 4000HS specifically designed to measure drop test strengths of components, especially useful for qualifying brittle lead-free solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. From the business point of view, the lead-free electronic product (green product) is also a market trend. Among many developed lead-free solder alloys, SnAgCu lead-free solder alloy is considered by the electronics industry to be the best alternative to eutectic tin-lead solder (Handwerker, 2005; Nurmi, et al., 2005
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. From the business point of view, the lead-free electronic product (green product) is also a market trend. Among many developed lead-free solder alloys, SnAgCu lead-free solder alloy is considered by the electronics industry to be the best alternative to eutectic tin-lead solder (Handwerker, 2005; Nurmi, et al., 2005
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/counterfeit-components-course-overview/
] Program Insight/Overview – CURRENT STRATEGIES FOR MITIGATING COUNTERFEIT COMPONENTS PRESENTED BY RICK STANTON – PRO-STD-001 COURSE DIRECTOR/CORPORATE VP OF QUALITY IC Leads Contaminated Leads Gold Plated Module Lead Lead Re-attachment Documented by the Department of Commerce, Counterfeit Electronic components
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/counterfeit/overview/
“PRESENTED BY RICK STANTON – PRO-STD-001 COURSE DIRECTOR/CORPORATE VP OF QUALITY” IC Leads Gold Plated Module Lead Contaminated Leads
