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? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
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. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-brings-its-flagship-inspection-systems-to-smtai
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
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. The Nordson YESTECH FX-940 Automated Optical Inspection (AOI) offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-wins-smt-china-magazine-awards-for-fx-940-aoi-system-with-3d-capability
& Convention Center during NEPCON China. The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-test-and-inspection-at-smt-nuremburg
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/live-demonstrations-on-nordson-inspection-systems-at-apex
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-to-exhibit-full-range-of-market-leading-test-and-inspection-systems
. The New FX-940 ULTRA 3D AOI from Nordson YESTECH incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips
Lewis & Clark | https://www.lewis-clark.com/product/vi-technology-5k-3d-large-board-aoi-2017/
&Theta, Presence, Absence & Polarity 3D Profiler Tool – Solder Joint Inspection & Lifted Lead Detection OCV – Optical Character Verification Match Maker Tool for Fast Program Creation Library Pro for Inspection Quality Insurance Library Live Update Teach
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-to-launch-advanced-new-3d-technology-for-automated-optical-inspection-at-apex-201
. The new FX-940 ULTRA 3D AOI incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips
