| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Formic acid reflow has been developed in industry as a fluxless reflow technology. During the process, formic acid vapor in a nitrogen atmosphere is introduced into the oven as an oxide removal agent
ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/510.html
Blog Solution machine News PCB conveyor system Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader Non-standard equipment Component lead former Component insertion feeder
ASCEN Technology | https://www.ascen.ltd/optical_inspection/510.html
Blog Solution machine News PCB conveyor system Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader PCB conformal coating system Component lead former Component insertion
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Compared the SnPb solder , the melting point of lead-free solder alloy is higher and more difficult to wet. The preheat temperature is too low or the flux is inactive
| http://etasmt.com/cc?ID=te_news_bulletin,21361&url=_print
>> News Introduction of Reflow Oven Temperature Zone Introduction of Reflow Oven Temperature Zone I.C.T high-performance reflow soldering oven , nitrogen reflow oven , lead-free SMT ovens, CBS PCB reflow oven, custom hot air reflow oven, I.C.T
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/electronics-assembly-and-packaging?con=t&page=8
plasma treatment of strip-type electronic components Nordson MARCH The compact machine provides highly uniform plasma treatment to lead frame strips, laminated substrates and other strip-type electronic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/ash-and-descum?con=t&page=9
: Ash and Descum Plasma Clean to Reduce Wire Bond Failures Nordson MARCH Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance Nordson MARCH
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/etchback-and-desmear?con=t&page=10
Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance Nordson MARCH Technology Drivers for Plasma Prior to Wire Bonding Nordson MARCH Plasma Power Plus Nordson MARCH Our
