| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. did this condition occur from tinning of the leads? In this case, the argument may be made that this is not a reject condition. In the strictest interpretation of the 610 standard, these components would still be rejected and dispositioned
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
| https://www.eptac.com/soldertips/solder-pot-maintenance-and-dross-removal/
. Any soldering done using a tinning pot should require wiping of the surface of the pot to remove the dross prior to inserting the component leads or wires into the pot
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Question: Regarding gold removal requirement under Section
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. I would suggest a strong OAH1 FLUX, for tinning the components, with an appropriate cleaning afterwards to remove any of the ionic residues from the surfaces of the leads and components
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
. I would suggest a strong OAH1 FLUX, for tinning the components, with an appropriate cleaning afterwards to remove any of the ionic residues from the surfaces of the leads and components
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. I would suggest a strong OAH1 FLUX, for tinning the components, with an appropriate cleaning afterwards to remove any of the ionic residues from the surfaces of the leads and components
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