| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
? Did the wire break at the weld? Did the plating come off the board? We need to define what kind of gold plating is on the board. Is it Electroplated Gold? Is it ENIG
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
. So if there is gold on the vias, it is not a defect. More SolderTips Visual Acuity Requirements for Soldering PEM® Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
“bottom only” and the castellations are gold. Is there anything we can do about the 75% gold removal rule? Answer: If you check J-STD-002, you will see the methods to check for solderability of those components
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
solderability ? Component and printed board storage life Storage conditions for longer life Artificial ageing tests and impact on yields International specifications and test methods Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
| https://www.eptac.com/faqs/ask-helena-leo/ask/defining-standard-industry-practices-for-torque-of-threaded-fasteners
Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed Have a question about training or IPC certification
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/FS-Award2020.pdf
SMT REFLOW SOLDERING EQUIPMENT- GLOBAL Company of the Year 2020 FROST & SULLIVAN BEST PRACTICES AWARD Company of the Year 2020 SMT REFLOW SOLDERING EQUIPMENT- GLOBAL BEST PRACTICES RESEARCH © Frost & Sullivan 2020 2
Heller Industries Inc. | http://hellerindustries.com/wp-content/uploads/2022/04/FS-Award2020.pdf
SMT REFLOW SOLDERING EQUIPMENT- GLOBAL Company of the Year 2020 FROST & SULLIVAN BEST PRACTICES AWARD Company of the Year 2020 SMT REFLOW SOLDERING EQUIPMENT- GLOBAL BEST PRACTICES RESEARCH © Frost & Sullivan 2020 2
