ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-brings-its-flagship-inspection-systems-to-smtai
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/discover-leading-test-and-inspection-platforms-from-nordson-at-smtai
. The Nordson YESTECH FX-940 Automated Optical Inspection (AOI) offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/live-demonstrations-on-nordson-inspection-systems-at-apex
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-wins-smt-china-magazine-awards-for-fx-940-aoi-system-with-3d-capability
& Convention Center during NEPCON China. The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-test-and-inspection-at-smt-nuremburg
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) at die. (a-4) Failure in bond (interface between wire and metallization) at substrate, package post, or other than die. (a-5) Lifted metallization from die. (a-6
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
. System can inspect SMT components pre-or post solder for presence / absence and placement verification (x,y,and theta ) polarity, solder fillet, bridging, solder opens, insufficient fillets, excess solder, and lifted leads
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
ASCEN Technology | https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/936.html
Blog Solution machine News PCB conveyor system Video Channel PCB conveyor transporter PCB depaneling machine PCB loader unloader PCB conformal coating system Component lead former Component insertion
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_bga-chamfer_topic727.xml
: The BGA, CGA is an exception... Author: Tom HSubject: 727Posted: 03 Dec 2012 at 3:12pmThe BGA, CGA is an exception because the plastic package is lifted off the board surface by the Balls or Columns.
