| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) at die. (a-4) Failure in bond (interface between wire and metallization) at substrate, package post, or other than die. (a-5) Lifted metallization from die. (a-6
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
Lewis & Clark | https://www.lewis-clark.com/product-tag/large-board-3d-aoi/
&Theta, Presence, Absence & Polarity 3D Profiler Tool – Solder Joint Inspection & Lifted Lead Detection OCV – Optical Character Verification Match Maker Tool for Fast Program Creation Library Pro for Inspection Quality Insurance Library Live Update Teach
Lewis & Clark | https://www.lewis-clark.com/product/vi-technology-5k-3d-aoi/
&Theta, Presence, Absence & Polarity 3D Profiler Tool – Solder Joint Inspection & Lifted Lead Detection OCV – Optical Character Verification Match Maker Tool for Fast Program Creation Library Pro for Inspection Quality Insurance Library Live Update Teach
Lewis & Clark | https://www.lewis-clark.com/product-tag/3d-aoi/
&Theta, Presence, Absence & Polarity 3D Profiler Tool – Solder Joint Inspection & Lifted Lead Detection OCV – Optical Character Verification Match Maker Tool for Fast Program Creation Library Pro for Inspection Quality Insurance Library Live Update Teach
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/meet-with-the-nordson-yestech-team-smtai-for-a-demonstration-on-the-fx-940-ultra-3d-aoi
. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-brings-its-flagship-inspection-systems-to-smtai
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/discover-leading-test-and-inspection-platforms-from-nordson-at-smtai
. The Nordson YESTECH FX-940 Automated Optical Inspection (AOI) offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-wins-smt-china-magazine-awards-for-fx-940-aoi-system-with-3d-capability
& Convention Center during NEPCON China. The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part
ASCEN Technology | https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/936.html
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