| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
• Solder paste exposed beyond worklife • Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
• Solder paste exposed beyond worklife • Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes
ASCEN Technology | https://www.ascen.ltd/Blog/Solutio/598.html
. Good flexibility, particularly at low temperatures Excellent chemical resistance Polyurethane coatings can be removed using specialist products (CCRG
| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf
| https://www.eptac.com/3-strategies-for-effective-rework-repair-of-pcbs/
. A common issue with PCB storage is the atmosphere. Things such as humidity, moisture, and temperature levels are all factors that can affect the quality of a PCB during the time it sits in storage
Imagineering, Inc. | https://www.pcbnet.com/blog/fr-4-vs-rogers-material-for-manufacturing-rf-pcbs/
. The coefficient of thermal expansion is a measurement of how robust a circuit board is under high temperatures. RF PCBs should be made of materials with a low CTE
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. In addition, it performs well after exposure to humidity and hot/cold cycles. Provides some initial repositionability when bonding to plastic parts (not metal
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Compared the SnPb solder , the melting point of lead-free solder alloy is higher and more difficult to wet. The preheat temperature is too low or the flux is inactive
| http://etasmt.com/cc?ID=te_news_industry,6361&url=_print
. If the viscosity is too high or too low, the printing quality will be affected. The storage environment of the solder paste requires the temperature to be maintained at 0-5 ° C
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