Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. These voids are the result of assembly process issues and do not have material or design root causes. Macro voids are due to assembly variation that can be eliminated with matched material and consistent process parameter selection/control
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. These voids are the result of assembly process issues and do not have material or design root causes. Macro voids are due to assembly variation that can be eliminated with matched material and consistent process parameter selection/control
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. One notable discovery in this stage was that torsion testing of a notebook motherboard could result in PCB pad cratering due to strain from the high modulus SAC alloy
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