Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
’ industry void definition standard [4]. Macro voids have been the focus of the electronics industry for influencing solder joint integrity
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
the solder metallurgy. The type of void considered in the current study is referred to as a “macro void”, occurring mostly within the bulk solder itself. Voiding (strictly “macro voiding”) is best described as the formation of fluid cavities in solder
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
(sharpen, smooth, edge detect, emboss, background subtract, etc.) Image histogram Electronics inspection tools (e.g BGA void recognition
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/10/Reflow-Soldering-2020.pdf
technology inserts into reflow oven lines to meet increasing demand for high-volume, void-free automated inline soldering. Heller reports this module reduces voids in a solder joint by 99%. It enables thermal profile porting directly from non-vacuum reflow
Heller Industries Inc. | http://hellerindustries.com/wp-content/uploads/2022/05/Reflow-Soldering-2020.pdf
technology inserts into reflow oven lines to meet increasing demand for high-volume, void-free automated inline soldering. Heller reports this module reduces voids in a solder joint by 99%. It enables thermal profile porting directly from non-vacuum reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/05/Reflow-Soldering-2020.pdf
technology inserts into reflow oven lines to meet increasing demand for high-volume, void-free automated inline soldering. Heller reports this module reduces voids in a solder joint by 99%. It enables thermal profile porting directly from non-vacuum reflow
