Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm
and manufacturing including Advanced Packaging Technology, Flux, Solder, Adhesives, Inspection Technologies, Manufacturing Excellence, Substrates/PCB Technology, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/uv-curing-equipment?con=t&page=28
. From wood and plastic, to glass and other heat-sensitive substrates, Nordson UV curing systems deliver greater application flexibility with a range of precisely focused and flood reflector geometries
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. This benefits small devices and devices with passives in close proximity. The PCD is a continuously volumetric pump that does not vary in volume even when viscosity and temperature change
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
. This benefits small devices and devices with passives in close proximity. The PCD is a continuously volumetric pump that does not vary in volume even when viscosity and temperature change
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
. This benefits small devices and devices with passives in close proximity. The PCD is a continuously volumetric pump that does not vary in volume even when viscosity and temperature change
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. As the demand for high interconnect solutions at the circuit board level increase, there must be performance improvements in components, interconnects and substrates
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. This reduces the manufacturing complexity, lowering weight and enabling new form factors since rigid PCBs are no longer required. The basic principle for in-mold electronics is that a circuit is printed onto a thermoformable substrate which is then molded to its desired shape and filled with injection-molded plastic
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% of transportation jobs will most likely be automated in the coming years in the United States. Autonomous vehicles are now the driving force of automation in this industry, as well as the manufacturing of vehicles making for quicker assembly times. With
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