| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/ionic-residue-value-conversion-from-metric-to-english
: Per J-STD-001D, paragraph 8.3.6.2, Static Extraction Method, the contamination shall be less than 1.56 micrograms/cm². What is the amount of allowable contamination per inches squared? Question
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-polyphenylene-sulfide-pps-film-capacitors-and-defects
. I recommend contacting the manufacturer directly and getting the information from them as to the allowable damage that can occur to the component without removing and replacing the device
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/how-to-monitor-and-track-height-sense-data
) method has the added benefit for being able to define a maximum and minimum limit. The user defines the maximum and minimum allowable tolerance the program will accept in order to proceed with the dispensing routine
| https://www.eptac.com/faqs/ask-helena-leo/ask/conductor-strand-damage-in-ipc-a-610-rev-e
. Table 6-2, Allowable Strand Damage, Note 3: Damaged strands have nicks or scrapes exceeding 10% of cross sectional area, was added to describe the depth of the damage related to nicks or scrapes
| https://www.eptac.com/faqs/ask-helena-leo/page/4
. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Read More Training Materials, Certificates and Soldering Kits QUESTION Question
| http://etasmt.com/cc?ID=te_news_bulletin,24967&url=_print
°C and reaches full liquidus at a range of 230-235°C — a mere 5°C below the maximum allowable temperature of 240°C. Maintaining such a small DT when processing any boards, and particularly laptop motherboards with Pentium BGA components, presents a significant reflow challenge
| http://etasmt.com/cc?ID=te_news_bulletin,24969&url=_print
. A high-efficiency ball bearing motor designed for a maximum operating temperature of 450°C helps maintain the very low DT required for lead-free reflow
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-tip-flooding-to-remove-leaded-solder
: All great questions. This concept has been talked about since the lead-free process was introduced 1984. The allowable amount is less than .1
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