| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Question
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-polyphenylene-sulfide-pps-film-capacitors-and-defects
: These components are not necessarily hermetically sealed as the traditional ceramic components. I checked various web sites on PPS film capacitors and none provide any information on mechanical damage to or on the body of the component
| https://www.eptac.com/faqs/ask-helena-leo/ask/conductor-strand-damage-in-ipc-a-610-rev-e
Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
. It improved the commonly used ‘through-hole’ technology by bringing advantages in ease of manufacturing and higher throughput. Nordson DAGE provide BondTesters for shear testing SMDs to perform quality control measurements on their adhesion to the PCB
| https://www.eptac.com/faqs/ask-helena-leo/page/4
: In IPC-A-610 section 9.4 on page 9-8 component damage there seems to be a lack of class three acceptable requirements for nicks or chip-outs in ceramic bodied components that are not in the termination area
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
– Agilis Automatic feeder and component recognition On-the-fly feeder loading Dynamic feeder positions Automatic board stretch compensation Automatic conveyor width adjustment Intelligent surface
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-tip-flooding-to-remove-leaded-solder
keeping the materials separate. More SolderTips Visual Acuity Requirements for Soldering PEM® Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question
% regardless of thermal plane. It all depends on how many leads the component has, with 14 being the magic number. Could you shed some light on “WHY
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4800-integra
The Nordson DAGE 4800 INTEGRA ® is a complete solution for automated semiconductor wafer bond testing. INTEGRA is designed for maximum throughput in an operator free environment
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
