| https://unisoft-cim.com/aoi_download.htm
identify where a short between two traces maybe. Search and find by netname or by part number. Also find by description field from the Bill Of Materials (BOM), for example find all "0.1uf capacitor". You can also find a Test Probe X/Y location and Test Probe
| https://unisoft-cim.com/soldering_download.htm
identify where a short between two traces maybe. Search and find by netname or by part number. Also find by description field from the Bill Of Materials (BOM), for example find all "0.1uf capacitor". You can also find a Test Probe X/Y location and Test Probe
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
modern manufacture. Surface mount components can be a problem area, as are some of the surface finishes used on printed circuit boards. The online session aims to provide a basic understanding of solderability failure including ageing, test methods, both
| https://unisoft-cim.com/gerber-connection_download.htm
( PCBA ) . For help and questions call us ( enable JavaScript for our phone number ) or email us ( enable JavaScript for our email address ). Overview of this ProntoGERBER-CONNECTION quick start tutorial procedure: Importing the Gerber layers. We will
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] The SPVC investigation demonstrated that the number of cycles to failure did not correlate with void size. If there was a negative influence of voids the solder joint integrity, Figure 3 would show a cluster of early low cycle failures for larger voids and a cluster of late cycle failures for the small voids
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
] The SPVC investigation demonstrated that the number of cycles to failure did not correlate with void size. If there was a negative influence of voids the solder joint integrity, Figure 3 would show a cluster of early low cycle failures for larger voids and a cluster of late cycle failures for the small voids
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/connectors
. Test standards covering connectors include IPC-TM-650, EIA-364,09C, MIL-STD-1344A. What can be tested? Insertion Force – The maximum push force required to push the two halves of the connector together. Withdrawal Force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/adhesive-dispensing-systems-products/altaspray-i-applicators
(75-90 psi) recommended Maximum Process Air Flow 1.2 scfm @ 190° C (375° F) 1 Maximum number of cycles depends on operating and control air pressure, as well as adhesive viscosities. 2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/adhesive-dispensing-systems-products/harmony-module
. 2 Maximum number of cycles depends on operating and control air pressures, and adhesive viscosity. 3 The hydraulic flow rate depends on operating system pressures and adhesive viscosity 4 Measured directly at the solenoid connector
. Read Answer Maximum Limits of Solder Bath Contamination Question: If we are using a solder pot to tin wires and create solder joints (splices
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