41 measuer solder peel strength results

Peel Back Force Tester

GPD Global | https://www.gpd-global.com/peel-back-force-tester.php?utm_source=dsapril2017&utm_campaign=newsletter&utm_medium=text

) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems

GPD Global

Peel Back Force Tester

GPD Global | https://www.gpd-global.com/co_website/peelforcetester.php

) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems

GPD Global

Peel Back Force Tester

GPD Global | https://www.gpd-global.com/peelforcetester.php?utm_source=dsapril2017&utm_campaign=newsletter&utm_medium=text

) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems

GPD Global

. Manko, Van Nostrand Reinhold Solder Joint Zone III 17 Zone 3 Plated Through Hole As =π*DW*Tb 6.28E-03 X*As = β * Ac 0.75 1/X = 133.5% 41.40 133.5% 414.0% From table the tensile strength of copper AWG 20 gauge is 31 pounds Zone 3 can support Comparison to tensile strength of AWG 20 Gage wire at 31 pounds Comparison to peel strength of 1 oz copper foil

| https://www.eptac.com/wp-content/uploads/2013/04/eptac_05_22_13.pdf

Tweezer Pull | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/tweezer-peel?con=t&page=2

. Nordson DAGE has been at the forefront of such testing since its… Hot Bump Pull Nordson DAGE Nordson DAGE has developed a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test in full accordance with the recently

ASYMTEK Products | Nordson Electronics Solutions

•  Prevent the application of vias in the areas of the pad •  Recommend review of IPC – 7351 Generic Requirements for Surface Mount Design and Land Pattern Standard 13 Comparison of Zones 14 Range of Shear strength of solder joint, psi Range of Tensile strength of solder joint, psi Peel

| https://www.eptac.com/wp-content/uploads/2013/06/eptac_06_19_13.pdf

Cold Bump Pull | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=4

) or a pre-defined force is… Tweezer Peel Nordson DAGE Nordson DAGE bondtesters provide tweezer peel tests (up to 5kg) as an alternative to pull testing to verify the adhesion or strength of a bond

ASYMTEK Products | Nordson Electronics Solutions

Vector Pull | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/vector-pull?con=t&page=2

. Tweezer Peel Nordson DAGE Nordson DAGE bondtesters provide tweezer peel tests (up to 5kg) as an alternative to pull testing to verify the adhesion or strength of a bond

ASYMTEK Products | Nordson Electronics Solutions

(Peel Strength, Surface Mount Bond Strength - Optional for SMT) This coupon shall be as shown in Figure 12-19. Coupon N is used for evaluating peel strength and may be used to evaluate the bond strength of surface mount lands

| https://www.eptac.com/wp-content/uploads/2015/02/eptac_03_18_15-1.pdf

Wire Pull Test Equipment | Wire Pull Tester | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=3

. Tweezer Peel Nordson DAGE Nordson DAGE bondtesters provide tweezer peel tests (up to 5kg) as an alternative to pull testing to verify the adhesion or strength of a bond

ASYMTEK Products | Nordson Electronics Solutions