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.Imported Micro X-Ray tube with original packaging(100/130 Kv closed tube),highly-sensitive image intensifier,2.0 million pixels industrial digital CCD camera,able to detect item<5 μ
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häufigsten gesuchten Defekte ist Head-In-Pillow oder HIP. Er wird oft in Ball Grid Array (BGA)-Bauteilverbindungen nach dem Reflow-Prozess beobachtet, wo die BGA-Kugel und die Lotpaste auf dem PCB-Pad keine
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). Surface-mount technology has been the primary device attachment method for a wide variety of… Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE Micro Materials Testing Brochure Nordson DAGE Micro Testing
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array
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