PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_does-capacitor-height-affect-pad-geometry_topic2366.xml
? : According to IPC-J-STD-001, the... Author: Tom HSubject: 2366Posted: 03 Feb 2019 at 8:55amAccording to IPC-J-STD-001, the chip package fillet height should be 25
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
0.65 mm and the Toe should be 0.50 mm for the best Toe Fillet. The DPAK is a separate component family Terminal Lead Form in Library Expert with different Toe values than SOP, QFP, SOT and SOD.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10535.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2587&OB=DESC.html
0.65 mm and the Toe should be 0.50 mm for the best Toe Fillet. The DPAK is a separate component family Terminal Lead Form in Library Expert with different Toe values than SOP, QFP, SOT and SOD
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2587&OB=ASC.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post9714.html
? Posted: 03 Feb 2019 at 8:55am According to IPC-J-STD-001, the chip package fillet height should be 25% of the package height or 0.50 mm, which ever is greater
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post10025.html
? Posted: 03 Feb 2019 at 8:55am According to IPC-J-STD-001, the chip package fillet height should be 25% of the package height or 0.50 mm, which ever is greater
