Lewis & Clark | http://www.lewis-clark.com/product-tag/used-smt/page/2/
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Lewis & Clark | http://www.lewis-clark.com/product-tag/used-pcba/page/2/
· (2) Cameras: 1 each: C4 2.6 & 4 mil camera CTR: 11482278 Condition: Complete and Operational Location & Shipping: USA / FOB Origin Availability
Lewis & Clark | https://www.lewis-clark.com/product-tag/used-pcba/page/2/
· (2) Cameras: 1 each: C4 2.6 & 4 mil camera CTR: 11482278 Condition: Complete and Operational Location & Shipping: USA / FOB Origin Availability
Lewis & Clark | https://www.lewis-clark.com/product-tag/used-smt/page/2/
· (2) Cameras: 1 each: C4 2.6 & 4 mil camera CTR: 11482278 Condition: Complete and Operational Location & Shipping: USA / FOB Origin Availability
Lewis & Clark | https://www.lewis-clark.com/product-tag/used-pick-and-place/
: Advantis 4982C Vintage: 2006 PEC Camera Single Beam Advanits – Lead Screw FlexJet 7 Spindle Head with 2.6 mil Camera Condition: Complete & Operational Ready To Buy? Let Us Know! First Name (required) Last Name (required) Company (required) Title
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/screws?con=t&page=32
Team was critical in helping Legendary Auto Interiors to produce sheet that is on-spec at required throughput. Switch to EDI® Automatic Die enables shrink sleeve film maker Innovia to improve tolerances by 30
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/extrusion?con=t&page=36
Team was critical in helping Legendary Auto Interiors to produce sheet that is on-spec at required throughput. NORDSON ELECTRONICS SOLUTIONS AT SEMICON CHINA 2020 Nordson SONOSCAN The latest products for semiconductor packaging will be demonstrated in Booth E3451 Solutions for Extrusion Coating Laminating
Lewis & Clark | https://www.lewis-clark.com/product-category/pick-place/
: 3000 cph Fine Pitch Capability: To 15 mil Pitch (0.381mm) Max Travel Area: 22″ (X Axis) x 22″ (Y-Axis) Cognex Vision System Feeders Available Separately from: Condition: Complete
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection/our-technologies---acoustic-microscopy?con=t&page=40
inspección tiene una amplia experiencia con pruebas no destructivas para dispositivos MIL-SPEC y High-Rel. Las delaminaciones y los vacíos pueden comprometer la hermiticidad de los dispositivos MEMS. Prueba de Nordson& La tecnología de microscopio acústico C-SAM®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/test-and-inspection/our-technologies---acoustic-microscopy?con=t&page=41
inspección tiene una amplia experiencia con pruebas no destructivas para dispositivos MIL-SPEC y High-Rel. Las delaminaciones y los vacíos pueden comprometer la hermiticidad de los dispositivos MEMS. Prueba de Nordson& La tecnología de microscopio acústico C-SAM®
