ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-JP/divisions/dage/test-types/die-shear?con=t&page=1
シェア 従来のダイ シェア テストでは、ロード セル ツールの正確なランディングと、基板へのツールの配置が必要です。 テストは標準的なボール シェアに似ており、以下の規格に従って行われます。 MIL STD 883 ロー プロファイル ダイ シェア テストは、試験対象のダイが非常に薄く、その高さプロファイルが接合される表面に対して低いときに必要になります。 比較的高荷重のダイ シェア ロード セル カートリッジを高精度の正確なシェア高さに組み合わせることと、自己整合ロード セル ツールを使用する
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=4
axis either until the bond breaks (destructive testing) or a pre-defined force is reached (non-destructive testing). Wire bond testing is covered by the external standard MIL-STD-883 (Methods
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=21
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=22
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=13
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/die-shear?con=t&page=11
über dem Substrat aus. Die Prüfung ist ähnlich wie bei Standard-Kugelschertests und wird in Übereinstimmung mit MIL STD 883 durchgeführt. Platinen-Scherprüfungen mit niedrigem Profil sind erforderlich, wenn die zu
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/die-shear?con=t&page=10
über dem Substrat aus. Die Prüfung ist ähnlich wie bei Standard-Kugelschertests und wird in Übereinstimmung mit MIL STD 883 durchgeführt. Platinen-Scherprüfungen mit niedrigem Profil sind erforderlich, wenn die zu
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=12
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=15
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
