| http://etasmt.com/cc?ID=te_news_bulletin,10761&url=_print
. Solder paste printing in the SMT process is critical to quality and efficiency! At present, the Chip parts selected for electronic products tend to be miniaturized and thinned, and the chip wiring pitch and the solder ball diameter are always reduced, which puts higher
| http://etasmt.com/te_news_industry/2013-06-08/4961.chtml
, high reliability, miniaturization, low cost, and production automation. This miniaturized components known as: the SMY device (or SMC, chip device). Component assembly process
Imagineering, Inc. | https://www.pcbnet.com/blog/importance-of-state-of-the-art-equipment-aerospace-pcb-assembly/
. Next-generation precision – provides extremely precise on-the-fly positioning and inspection for any type of miniaturized or specialized component
| http://etasmt.com:9060/te_news_industry/2013-06-08/4961.chtml
, high reliability, miniaturization, low cost, and production automation. This miniaturized components known as: the SMY device (or SMC, chip device). Component assembly process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/new-nordson-efd-781mini-spray-valve-uniform-spray-control-in-smaller-form-factor-8-23-16
,” said Claude Bergeron, Global Product Line Manager – Valves. “These features provide considerable advantages to our customers. The ability to spray more uniform micro spray patterns as narrow at 1 mm wide onto miniaturized parts with exceptional consistency and repeatability, and nearly zero overspray, reduces rework and
| http://etasmt.com/te_news_bulletin/2019-09-11/10761.chtml
. Solder paste printing in the SMT process is critical to quality and efficiency! At present, the Chip parts selected for electronic products tend to be miniaturized and thinned, and the chip wiring pitch and the solder ball diameter are always reduced, which puts higher
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/nordson-efd-launches-4-axis-r-series-automated-dispensing-system-4-27-16
. Maintaining specifications on parts and components that are continuously being miniaturized makes it difficult and tedious for manual operations,” Fernandez says
| http://www.feedersupplier.com/SMT_THROUGH_HOLE
. In addition, the size and footprint of SM components can be miniaturized compared to their TH counterparts. The leads may be eliminated completely in favor of contact terminals on the ends of the component body
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-a-flex-pcb/
. Thanks to their miniaturized design, they can decrease package weight by up to 75%. Another key feature comes from minimizing connection points, eliminating interconnection defects that are common with solder joints
Blackfox Training Institute, LLC | https://www.blackfox.com/whats-the-difference-between-th-and-smt-soldering/
. No space is wasted as there is no need to mount inside of larger drilled holes. The size and footprint of surface mount components can also be miniaturized, which isn’t possible for TH
.png)