Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
of the BEoL Region of a Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh, Dereje Agonafer Abstract 27-2 Stencil and Solder Paste Inspection Evaluation for Miniaturized SMT Components Robert Farrell and Chrys Shea
