79 minimum heel fillet height results

Does Capacitor Height Affect Pad Geometry? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post9714.html

.  Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height

PCB Libraries, Inc.

Does Capacitor Height Affect Pad Geometry? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post10025.html

.  Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height

PCB Libraries, Inc.

Does Capacitor Height Affect Pad Geometry? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/does-capacitor-height-affect-pad-geometry_topic2366.html

.  Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height

PCB Libraries, Inc.

Does Capacitor Height Affect Pad Geometry? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366.html

.  Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height

PCB Libraries, Inc.

Does Capacitor Height Affect Pad Geometry? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2366&OB=ASC.html

.  Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height

PCB Libraries, Inc.

of this statement seems to talk about the heel fillet height as well as solder thickness. The second question was from IPC-A-610, Figure 8-89 and the flow of information regarding the placement and soldering of the component

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

IPC-J-STD-001 Chip Component Solder Joints - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html

as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is

PCB Libraries, Inc.

IPC-J-STD-001 Chip Component Solder Joints - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html

as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is

PCB Libraries, Inc.

IPC-J-STD-001 Chip Component Solder Joints - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html

as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is

PCB Libraries, Inc.

IPC-J-STD-001 Chip Component Solder Joints - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post12079.html

as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is

PCB Libraries, Inc.