Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
requirement but did undergo a loss of solder joint integrity. Figure 23 (top image) illustrates two BGA corner/outer row solder joints that failed in the typical mode but with no voiding present. Figure 22. Macro (Top) and Magnified (Bottom) Views, BGA Void
| http://www.szhonreal.com/uploadfile/Download/202305231109343783.pdf
. Available for 8mm tape and components from 0402 (metric) to 3216. OCC 先頭部品の頭出し Feature4 Auto tape advance function 25㎜ 1㎜ 6㎜ 12㎜ 20㎜ 360-degree component recognition image Changing the RS-1 functionality does not require head replacement
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Lipstick-Camera-Single-and-Dual-User-Guide-22293042M.pdf
. This allows the camera image either to be viewed on an optional, external monitor or output to a connection on the dispenser service panel
GPD Global | https://www.gpd-global.com/pdf/doc/Lipstick-Camera-Single-and-Dual-User-Guide-22293042M.pdf
. This allows the camera image either to be viewed on an optional, external monitor or output to a connection on the dispenser service panel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-to-launch-advanced-new-3d-technology-for-automated-optical-inspection-at-apex-201
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KingFei SMT Tech | https://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce
. SMT DEFECT SPECTRUM OF THE PRINTING PROCESS --NO SOLDER --INSUFFICIENT SOLDER --EXCESSIVE SOLDER --BRIDGING --50-60% Most people put all the emphasis on the AOI machine to detect the above defects which can be controlled effectively with a 3D SPI measurement system even before going through the reflow process Tag
KingFei SMT Tech | http://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce
. SMT DEFECT SPECTRUM OF THE PRINTING PROCESS --NO SOLDER --INSUFFICIENT SOLDER --EXCESSIVE SOLDER --BRIDGING --50-60% Most people put all the emphasis on the AOI machine to detect the above defects which can be controlled effectively with a 3D SPI measurement system even before going through the reflow process Tag
Lewis & Clark | https://www.lewis-clark.com/product/vi-technology-5k-3d-aoi/
Vi Technology 5K 3D AOI (2017) - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=5
component cracking and warping. This is made possible by Dage’s 4th generation x-ray tube and image chain allowing features as small as 100nm to be resolved
