ORION Industries | http://orionindustries.com/pdfs/mylarel21.pdf
. Typical Values for Major Properties Tensile Dimensional Nominal Strength Stability Dielectric Thickness, MD/TD,* Elongation MD/TD,* Density, Strength (AC), µm (Gauge) kg/mm2 (kpsi) MD/TD,* % % Shrinkage Opacity
ORION Industries | http://orionindustries.com/pdfs/mylarel1-5.pdf
. Typical Values for Major Properties Tensile Dimensional Nominal Strength Stability Dielectric Thickness, MD/TD,* Elongation MD/TD,* Strength (AC), µm (Gauge) kg/mm2 (kpsi) MD/TD,* % % Shrinkage Haze, % kV (Min.) 12 (48) 18/22 (26/32) 110/70 2.0/1.0 4 2.8 19
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/imaps-technical-presentation-and-lunch
. This underfill process is being used in production for chip-on-wafer and chip-on-BGA packaging. In one example, underfill must be dispensed within 300-500um KOZ of 2-5 mm2 size die at 4000 UPH
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