Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. The interior humidity of the bag should stay at less than 10% at 77°F. Any exposure to dampness may require a re-bake, which should reverse any moisture the device has collected
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process
| https://www.eptac.com/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating/
: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5101
. In addition, alternate drying and storage conditions for the moisture/reflow sensitive materials will be evaluated and compared with default bake conditions specified in IPC/JEDEC J-STD-033. Key Words
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
Heller Industries Inc. | https://hellerindustries.com/delamination/
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
| https://www.eptac.com/faqs/ask-helena-leo/page/3
. In theory, parylene deposition will draw off any moisture before the coating process. Currently we bake at 149F for one... Read More Building to IPC-A-610 or J-STD-001 QUESTION Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. We understand the need for baking to remove moisture. Comments? Answer: Baking the boards may or may not be necessary depending upon how they were stored and whether or not they were multilayer boards
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
, Ph.D., David Bernard Consultancy To Bake or Not to Bake? Large Metallic BGAs in Sealed ESD Bags with no Indication of Humidity Exposure Bihari Patel, Microart Services Inc
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