PCB Libraries, Inc. | https://www.pcblibraries.com/forum/solder-masks_topic1380_post5514.html
. I've attached an image of the property box for a pad in Altium. In the bottom-right there is the option to manually overwrite the global solder mask expansion setting and then specify a custom expansion value
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/solder-masks_topic1380_post5510.html
. I've attached an image of the property box for a pad in Altium. In the bottom-right there is the option to manually overwrite the global solder mask expansion setting and then specify a custom expansion value
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1380&OB=DESC.html
. I've attached an image of the property box for a pad in Altium. In the bottom-right there is the option to manually overwrite the global solder mask expansion setting and then specify a custom expansion value
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1380&OB=ASC.html
. I've attached an image of the property box for a pad in Altium. In the bottom-right there is the option to manually overwrite the global solder mask expansion setting and then specify a custom expansion value
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. During solder reflow, the combination of rapid moisture expansion and materials mismatch can result in package cracking and/or delamination of critical interfaces within the package
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. Any components that are sheathed in plastic or organic compounds are susceptible to this type of damage. Moisture absorption damage typically occurs during the solder reflow process
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/
. Moisture control in printed circuit board manufacturing has increasingly become a problem throughout the industry at large. Miniaturization has caused devices to become significantly smaller, increasing their overall sensitivity
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-industry-trends-that-matter-in-2022/
. Higher temperatures are required during the solder reflow process to create today’s printed circuit boards. Rapid moisture expansion and mismatched materials contribute greatly to this, particularly in ball grid array and chip-scale packages
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste
: Consider Halogen-Free Flux and Solder Paste Back to all posts Part 2 of 2 – The Need for Halogen-Free Materials and the Impact on Your Electronics Manufacturing Process By John Vivari What will happen if halogen-containing substances are banned from use in electronics manufacturing
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
. However, pure copper is also chemically active, requiring a coating over exposed copper to prevent corrosion. These coatings typically include aerosol coatings and solder masks, although manufacturers may also use epoxy coatings as a barrier to oxidation
