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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf
. PC mother boards with large BGA devices can also be run successfully with reduced blower speeds in ramp-up and cooling modules and full blower speed in reflow modules
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/ultralow.pdf
. PC mother boards with large BGA devices can also be run successfully with reduced blower speeds in ramp-up and cooling modules and full blower speed in reflow modules
| http://etasmt.com/cc?ID=te_news_bulletin,23762&url=_print
. PC mother boards with large BGA devices can also be run successfully with reduced blower speeds in ramp-up and cooling modules and full blower speed in reflow modules
| http://etasmt.com/cc?pageID=newsList&ID=te_news,0&pNum=18
? Show Details The probability that air will be drawn into the oven against the current of escaping nitrogen. Most circuit boards with moderate thermal mass such as cell phones, PC mother boards and peripherals can be profiled successfully without bottom side forced convection
