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(or other substrate) method is called SMT process. Related assembly equipment is called SMT equipment. SMT features: High density assembly, electronic products small size, light weight, about 1/10 of the chip component size and weight of traditional plug-in component, generally, SMT electronic products volume is reduced from 40% to 60%, weight from 60% to 80
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indirectly lead to civil or criminal liability Reflow oven,SMT Reflow Soldering Oven Manager has the right to delete or retain your message You are in the Reflow oven,SMT Reflow Soldering Oven message board
| http://etasmt.com/te_news_industry/2013-06-08/4961.chtml
(or other substrate) method is called SMT process. Related assembly equipment is called SMT equipment. SMT features: High density assembly, electronic products small size, light weight, about 1/10 of the chip component size and weight of traditional plug-in component, generally, SMT electronic products volume is reduced from 40% to 60%, weight from 60% to 80
| http://etasmt.com:9060/te_news_industry/2013-06-08/4961.chtml
(or other substrate) method is called SMT process. Related assembly equipment is called SMT equipment. SMT features: High density assembly, electronic products small size, light weight, about 1/10 of the chip component size and weight of traditional plug-in component, generally, SMT electronic products volume is reduced from 40% to 60%, weight from 60% to 80
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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3 Road Xintang， Fuhai Street，Fuyong
Shenzhen, 30 China
Phone: 13713862102
