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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
Wire-Bonding Reliability of Electroless Ni/Pd/Au Plating - Influence of Electroless Pd Deposition Reaction 中文 MEMBERS LOGIN Membership Become a Member
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
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: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. PREVIOUS： 03076404-01 NEXT： 03076588-01 RELATED PRODUCTS CATEGORIES ABOUT US
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:03076575-01 Description: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. Previous： 03076404-01 Next： 03076588-01 RELATED PRODUCTS CATEGORIES ASM EQUIPMENT Equipment Accessories PANASONIC EQUIPMENT Equipment Accessories YAMAHA EQUIPMENT Equipment Accessories FUJI EQUIPMENT Equipment Accessories JUKI
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KOHYOUNG NUTEK OTHER PARTS CONTACT US welcome to KD Electronic Equipment Accessories Product number:03076575-01 Description: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl
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. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
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