38 ni/sn plating results

The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial I

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246

The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文

Surface Mount Technology Association (SMTA)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

) solder is commonly used as lead finish material, which are deposited either by solder plating or solder coating.    There are a number of reasons why the Sn/Pb binary system had become a popular choice as lead finish material

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml

) solder is commonly used as lead finish material, which are deposited either by solder plating or solder coating.    There are a number of reasons why the Sn/Pb binary system had become a popular choice as lead finish material

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml

) solder is commonly used as lead finish material, which are deposited either by solder plating or solder coating.    There are a number of reasons why the Sn/Pb binary system had become a popular choice as lead finish material

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will

Surface Mount Technology Association (SMTA)

High Reliability Alloy Solder Paste For ENIG - PCBASupplies

| https://pcbasupplies.com/alloy-solder-paste-enig/

. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish

– IPC/ WHMA-A-620 4 The Criteria – NASA – 8739.3 •  7.2.5 c - Gold plating on all surfaces that become part of finished solder connections shall be removed by two or more successive tinning operations (solder pot or iron

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Best Papers - Award Winners | SMTA International

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. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura

Surface Mount Technology Association (SMTA)

•  In Sn-rich solders on a Cu substrate, Cu6Sn5 (η) or Cu3Sn (ε) intermetallic layers are formed at the solder/substrate interface 6 Adapted by Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal

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– IPC/ WHMA-A-620 7 The Criteria J-STD-001 Rev E •  The (a) information in 620 is based upon Rev E 8 The Criteria – NASA – 8739.3 •  7.2.5 c - Gold plating on all surfaces that become part of finished solder connections shall be removed by two or more successive tinning operations (solder pot or iron

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf